Internship: Software Developer with AI/ML Focus for Chip-Package-Board CoDesign
Infineon Technologies Austria AGKI-Zusammenfassung
Join Infineon’s Chip-Package-Board CoDesign team in Villach, Austria, and support cutting-edge semiconductor design through AI/ML-driven software solutions. This internship offers hands-on experience with EDA workflows, Python/Java development, and data-driven optimization.
- Design, implement, and maintain software solutions supporting semiconductor design processes
- Apply AI/ML algorithms to enhance automation in Electronic Design Automation (EDA) workflows
- Develop tools using Python, Java, and Cadence SKILL for advanced design challenges
- Analyze design data to identify optimization opportunities and implement data-driven solutions
- Participate in code reviews, documentation, and test plan development
Requirements: Current student in Computer Science, AI, Electrical Engineering, or related field. Experience with Python/Java, interest in Cadence SKILL, analytical skills, and familiarity with Agile/Git.
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