Staff Engineer Simulation and Package Design Methodology

Develop and support simulation methodologies, design flows, and tool environments for Chip-Package-Board (CPB) Co-Design and advanced package development in Linux-based HPC environment. Drive and continuously improve methodologies for electromagnetic, thermal and multiphysics analysis supporting semiconductor package and system development. Own and maintain the simulation environment within the CPB Co-Design Flow & Methodology team and provide consulting and support to product development projects worldwide. Enable simulation-driven design and verification for advanced packaging technologies including System-in-Package (SiP), heterogeneous integration, and 2.5D/3D package solutions. Collaborate closely with Business Lines, Design Systems, package development teams, and external technology partners. Drive technology evaluations, benchmarks, automation initiatives, and knowledge sharing activities.

Required qualifications:

• Degree in Electrical Engineering, Microelectronics, Physics, Computational Engineering, Mechanical Engineering, or related technical discipline
• At least 4 years of professional experience in semiconductor package development, simulation, design methodologies, EDA environments, or related engineering fields
• Strong background in electromagnetic, thermal or multiphysics simulation for semiconductor package and system development
• Hands-on experience with industry-standard simulation environments such as Synopsys/Ansys, Cadence, Siemens, Keysight, COMSOL, or comparable engineering platforms
• Proven track record in developing, optimizing, and deploying simulation methodologies, engineering workflows, and design environments
• Solid knowledge of Linux and one or several programming languages: Python, bash, MATLAB, Perl
• Strong analytical and problem-solving skills combined with excellent communication abilities and a customer-oriented mindset

Advantages:

• Experience with development and integration of Machine Learning (ML) and Artificial Intelligence (AI) tools for design or simulation

Fluent English skills are required; German language skills are considered as an advantage.

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