Software Developer with AI/ML Focus for Chip-Package-Board CoDesign
Infineon Technologies Austria AGKI-Zusammenfassung
Location: Villach, Austria
Employment Type: Internship (Full-time/Part-time, flexible hours Mon-Fri 6 a.m.-7 p.m.)
Duration: Minimum 12 months
Job Family: Research & Development
Join Infineon's Chip-Package-Board CoDesign team to develop AI/ML-enhanced software solutions for semiconductor design. You will:
- Design, implement, and maintain software solutions supporting semiconductor design processes
- Apply AI/ML algorithms to improve EDA workflow automation and efficiency
- Develop tools using Python, Java, and Cadence SKILL within the EDA framework
- Analyze design data to identify optimization opportunities using data-driven approaches
- Create AI/ML-integrated tools for simulation, validation, and testing processes
- Participate in code reviews and maintain high-quality documentation
- Acquire Cadence SKILL programming skills for CoDesign challenges
Requirements:
- Student in Computer Science, AI, Electrical Engineering or related field
- Experience with Python, Java, Perl and AI/ML frameworks
- Interest in learning Cadence SKILL for EDA solutions
- Analytical and problem-solving skills
- Basic understanding of AI/ML concepts (algorithms, data preprocessing, model deployment)
- Familiarity with Agile, Git, and project management tools (e.g., Jira)
- Ability to work independently and collaboratively in cross-functional teams
Application Documents (German/English):
- Motivation letter
- CV
- University matriculation certificate
- Latest transcript of records (<6 months old)
- Highest completed educational certificate
- Reference letter (optional)
Contact: Ramona Steiner
Infineon is a global leader in semiconductor solutions driving green energy, safe mobility, and secure IoT. We champion diversity and inclusion in a trust-based, open work environment.