Senior Staff Engineer Chip Package Board - CoDesign Flow and Methodology
Infineon Technologies Austria AGKI-Zusammenfassung
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Your Role
- Define and drive the technical roadmap for Chip-Package-Board (CPB) design methodologies, flows, tools, and digital engineering capabilities. Partner closely with Business Lines, Design Centers, and engineering communities.
- Translate Business Line needs into methodology enhancements, design-flow improvements, simulation capabilities, automation concepts, and EDA roadmap requirements.
- Drive continuous improvement of CPB methodologies and engineering workflows to accelerate design convergence, improve design quality, and increase first-pass success.
- Identify and shape future capabilities required for advanced packaging, heterogeneous integration, System-in-Package (SiP), 3D design methodologies, multi-domain simulation, and AI-assisted engineering workflows.
- Lead AI, automation, data, and digitalization initiatives that deliver measurable engineering and business value.
- Provide technical leadership, consulting, training, and enablement for global user communities and stakeholders.
Your Profile
- Degree in Electrical Engineering, Microelectronics, Physics, Computer Engineering, or related field, with minimum 8 years of experience in semiconductor development, design methodologies, EDA environments, package development, design automation, simulation, or related fields.
- Strong understanding of semiconductor product development, including chip, package, board, simulation, and system-level interactions.
- Proven experience in defining, optimizing, and deploying engineering methodologies and design flows.
- Experience working with EDA technologies and vendors (e.g., Cadence, Synopsys, Keysight, Comsol).
- Strong customer-oriented mindset with ability to balance operational excellence with long-term methodology, technology, and business strategy.
- Proven track record of leading cross-functional initiatives.
- Fluent English skills required; German language skills are advantage.
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