Software Development and AI for Chip Package Board Codesign

Software Development and AI for Chip Package Board Codesign (w/m/div)

Your Role

• Develop and support software solutions for comprehensive chip-package-board co-design workflows and methodologies
• Translate co-design and design methodology needs into high-quality code, ensuring robustness, scalability and speed
• Develop and deploy AI/ML based software to enhance design and verification efficiency
• Optimize and refactor existing in-house software modules
• Build intelligent data pipelines to collect and analyze design and simulation results
• Bridge the gap between software and EDA tools by utilizing advanced APIs and scripting interfaces

Your Profile

You remain aware of the big picture even in complex situations and take decisions despite uncertain circumstances. You have the passion and courage to develop new and creative ideas and inspire others.

Qualifications and skills to help you succeed

• A degree in Computer Science, Data Science, Electrical Engineering or similar technical field
• Minimum 2 years of experience in software development
• Expert proficiency in Python and experience with data science/AI libraries (Pandas, Scikit-Learn, PyTorch, TensorFlow)
• Strong interest in Hardware-Aware software development
• Experience in Linux environments, shell scripting and handling large-scale data sets
• Basic knowledge of EDA workflows
• Customer-oriented mindset with ambition to solve technical problems
• Fluent English skills, German skills are a plus

Contact: Mag. Stefanie Triebelnig, BA, LinkedIn

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