Plasma R&D Process Engineering - Dry Etch / PECVD

Silicon Austria Labs GmbH
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KI-Zusammenfassung

Das SAL MicroFab sucht einen motivierten Plasma R&D Process Engineer mit Schwerpunkt auf Dry Etch und PECVD. In dieser Rolle übernehmen Sie herausfordernde Aufgaben und tragen zur kontinuierlichen Verbesserung der Prozesse bei. Sie arbeiten unabhängig und erweitern kontinuierlich Ihre Fähigkeiten, um den Erfolg des Teams zu fördern.

The SAL MicroFab is looking for a motivated Plasma R&D Process Engineer with focus on Dry Etch and PECVD to join the team. As an R&D Process Engineer, you will take on challenging and responsible tasks with corresponding decision-making scope. You will work independently across all required activities, continuously expand your skill set, and contribute to the growing success of the team.

Your future tasks include:

  • Develop, optimize, and sustain plasma etch (dry etch) & deposition (PECVD) processes to support diverse R&D flows.
  • Establish stable, repeatable process baselines and maintain tight control through SPC and regular performance monitoring.
  • Own and maintain plasma tools, ensuring high uptime and process consistency.
  • Define and document process parameters, recipes, and best practices to ensure reproducibility across experiments and flows.
  • Collaborate with the process engineering team members to ensure process compatibility across the full fabrication flow.
  • Lead troubleshooting, root cause analysis and continuous improvement activities to maintain high process quality and tool uptime.
  • Support tool upgrades, new equipment acquisition, and capability expansion projects.

Your profile:

  • Master’s degree (Bachelor's degree with equivalent relevant experience) in Materials Science, Physics, Electrical Engineering, or related field.
  • Minimum 3 years of experience as a plasma process engineer in an industrial or applied research semiconductor FAB; 5+ years preferred.
  • Hands-on experience with plasma etch systems (e.g., ICP, RIE, PECVD).
  • Proven ability to establish robust and transferable etch processes supporting multiple technologies.
  • Proven experience with methodologies - process control, SPC, Problem Solving, CIP, Lean, equipment maintenance principles, etc.
  • Demonstrated ability to work effectively in a research-driven environment supporting multiple stakeholders.
  • Excellent teamwork, communication, reporting, and organizational skills.
  • Analytical, detail-oriented, and proactive in driving process and equipment improvements.
  • Willingness to relocate to Villach, Austria.

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