Master Thesis - Experimental determination of fracture properties of deliberately weakened layers in silicon carbide

Villach (Austria)

Your Role

• Techniques: Gain exposure to fracture‑mechanical testing, scanning electron microscopy, and three‑dimensional (3D) surface mapping via white‑light interferometry

• Application: Transfer experimental insights to structures relevant to sustainable, low‑waste wafering in the semiconductor domain

• Characterization: Investigate how manufacturing parameters influence interface toughness and morphology to support data‑driven process optimization

• Correlation: Use and refine an existing testing workflow to produce robust mechanical datasets and correlate them with microscopy observations

Further Information:

• Type of employment: Temporary / Full-time (flexible working hours from Monday to Friday between 6 a.m. and 7 p.m.)

• Duration: 8 months

Your Profile

• Education: Enrolled in a Master in Materials Science, Physics or Mechanical Engineering

• Sample Prep and Testing: Experience in or strong motivation to learn about mechanical sample preparation and testing

• Microscopy Techniques: Knowledge of or a strong willingness to learn microscopy methods including electron microscopy

• Language Skills: Ability to work and communicate well with our international team in English and/or German

This position is subject to the collective agreement for workers and employees in the electrical and electronics industry (full-time), employment group B for bachelor students, employment group D for master students.

Please attach the following documents (German or English) to your application:

• Motivation letter

• CV

• Certificate of matriculation at a university

• Latest Transcript of records (up-to-date)

• Highest completed educational certificate (Matura certificate for Bachelor students, Bachelor certificate for Master students)

• Reference letter (optional)

Contact: Ina Miklau

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